Realizes precise processing of difficult to cut materials based on superior wear resistance and rigidity
Metal bond
Applications: Electronics components, Optical devices, Various types of ...
HogoMax Series
Water-soluble protective film for laser processing
Highly purified water-soluble protective film for semiconductor processes
- HogoMax is a water-soluble resin that prevents particles from ...
Achieves high productivity and superb dicing results through excellent dicing performance and long life
Electroformed bond
Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, ...
With an emphasis on cutting performance, this blade provides high processing quality for difficult-to-cut materials
Resin bond
Applications: Glass, Crystal, Quartz, LiTaO3, Various types of ...
Realizes high-grade cutting of various hard, brittle materials with a wide range of bonds
Resin bond
Applications: Glass, Quartz, Ceramics, etc
A bond material optimal for the characteristics ...
Prevents pad corrosion during dicingPad corrosion prevention
For workpieces that have a long cut time, such as a workpiece with a small die size and a large ...