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DFL7341
Achieves high productivity for sapphire, lithium tantalate, and MEMS processing
Φ200 mm Stealth Dicing™ SDBG SDTT
- DFL7341 is a fully automatic laser saw for Φ8-inch ...
DFL7360FH
Stealth Dicing
A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander.
• Controls ...
DFL7361
Stealth Dicing
A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander.
• Controls ...
DFL7560L
Laser Lift-Off Equipment with Wide Process Margin using DPSS Laser
Φ150 mm
Laser Lift-off
- Laser Lift-off is a technology used to detach the material layer from the ...
DFM2800
Realizes faster processing of ultrathin wafers
Φ300 mm
DBG
SDBG
Wafer Thinning
Realizes high yield thin wafer processing
The DFM2800 is a specialized wafer mounter for inclusion ...
Disco-DFL7362
Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si
• Φ300 mm • Stealth Dicing™ • SDBG • SDTT
- DFL7362 is a ...
EX-300
EX Series
Model:
EX-300 for Gr-12
The EX series is an adopted motor drive for expansion stage operation.
Expansion stroke and expansion speed can be controlled numerically.
And film auto-cut function is equipped ...
FM-2246 / 2248 /2243
You can select a manual wafer mounter from a wide range of models to meet a variety of needs, from research and development to semi-custom production.
This manual wafer mounter series supports three different sizes of ...
FM-3343
This wafer mounter is ideal for diversified tape application and lamination conditions.
This model meets user requirements for manual equipment that is automated for only critical application work and that allows for ...
FM-6648 / 6643
This model was developed for both pre-cut and normal tape.
The industry's first universal wafer mounter, it not only serves as a dedicated wafer mounter for pre-cut or normal tape, but can also be adapted to the ...
FM-903S
FM-903 is normal type semi-automatic wafer mounter up to 8 inch(200mm) size of work.
Automatic operation means the operator is required only for loading and unloading workpieces. This contributes to stable tape and ...
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