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tm11series
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TM11 Series

Metallic blades that realize higher rigidity
Improved blade rigidity By employing a high-rigidity bond, the TM11 series ...
ultra
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UltraPoligrind

Achieves both high die strength and gettering performance using ultra-fine diamonds
Applications: Silicon wafer, etc UltraPoligrind employs an ultra-fine diamond abrasive to create higher die ...
ultra_sonic
Ultrasonic-wave9
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Ultrasonic-wave dicing unit

Realizes high quality and high speed processing of difficult-to-cut materials Targets for ultrasonic-wave processing Ultrasonic-wave processing aims to achieve good processing ...
Ultrasonic-wave
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Ultrasonic-wave dicing unit

Realizes high quality and high speed processing of difficult-to-cut materials Ultrasonic-wave pulses promote active self sharpening of the blade to ensure high quality and high speed processing of difficult to- cut ...
VT07_12SERIES
VT07_12SERIES_1
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VT07/12 Series

Vitrified bond blade for high-load processing
The VT07/12 series can handle various materials from processing of difficult-to-cut ...
200 mm Wheel Guard
300 mm Wheel Guard
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Wheel Guard

Protects wheel segments for streamlined wheel replacement and easier handling.


z05_1
z05_2
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Z05 Series

Ultra-high cutting performance for diverse applications.
The Z05 Series offers ultra-high cutting performance for a wide range of ...
z09
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Z09 Series

Electroformed blades with higher strength and variety of oncentration
The Z09 series adopts a newly developed high strength bond and meets ...
ZH05SERIES
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ZH05 Series

Provides stable processing through high-accuracy concentration control Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), Oxide wafers (LiTaO3, etc.), ...
ZH14SERIES
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ZH14 Series

Adoption of the newly developed and highly rigid V1 bond to realize stable processing under high load conditions Electroformed bond Applications: Silicon wafer, Compound ...
zhcrseries
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ZHCR Series

Provides stable processing through increased blade edge deformation resistance Electroformed bond Applications: Silicon wafer, etc For relatively thick blades in excess of 60 ...
zhdg1
zhdg2
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ZHDG Series

Electroformed hub blades producing high quality substrate dicing
Electroformed bond Applications: Chip LED board, Various types of semiconductor packages, etc The ZHDG series developed for ...
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