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DAL7020
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DAL7020

Ablation Process A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting. • Little to no heat damage to the workpiece. • ...
DFL7020
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DFL7020

Ablation Process A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting. • Little to no heat damage to the workpiece. • ...
DFL7161
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DFL7161

High-quality, high-throughput standard laser grooving model Φ300 mm Ablation
  • DFL7161 is a fully automatic laser saw for Φ300 mm wafers which has already seen wide ...
DFL7160
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DFL7160

Supports various applications, including full cut and DAF cut Φ300 mm Ablation
  • DFL7160 is a fully-automatic laser saw for Φ300 mm wafers which uses a pulse laser to ...
DFL7341
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DFL7341

Achieves high productivity for sapphire, lithium tantalate, and MEMS processing Φ200 mm    Stealth Dicing™   SDBG   SDTT
  • DFL7341 is a fully automatic laser saw for Φ8-inch ...
DFL7361
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DFL7361

Stealth Dicing A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander. • Controls ...
DFL7360FH
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DFL7360FH

Stealth Dicing A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander. • Controls ...
DFL7560L
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DFL7560L

Laser Lift-Off Equipment with Wide Process Margin using DPSS Laser Φ150 mm Laser Lift-off
  • Laser Lift-off is a technology used to detach the material layer from the ...
z05_1
z05_2
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Z05 Series

Ultra-high cutting performance for diverse applications.
The Z05 Series offers ultra-high cutting performance for a wide range of ...
z05_2
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R07 Series

Realizes high-grade cutting of various hard, brittle materials with a wide range of bonds
Resin bond Applications: Glass, Quartz, Ceramics, etc A bond material optimal for the characteristics ...
z09
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Z09 Series

Electroformed blades with higher strength and variety of oncentration
The Z09 series adopts a newly developed high strength bond and meets ...
b1_a
b1
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B1A Series

Realizes precise processing of difficult to cut materials based on superior wear resistance and rigidity
Metal bond Applications: Electronics components, Optical devices, Various types of ...
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