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cassette_frames
Product Classification

Cassette and tape frame

High precision products to facilitate stable production from tape mounter to die bonder. Meets the ø300 mm wafer SEMI standard.

gf01_series
Product Classification

GF01 SERIES

Realizes optimum wheel life by employing a new bas
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc The newly developed GF01 Series in-feed grinding wheels ...
GF136
Product Classification

GF13 Series

GRINDING WHEELS Improved productivity and grinding quality Grinding wheel for semiconductor wafer
•Supports SDBG ...
hogo
hogomax
Product Classification

HogoMax

HogoMax Series Water-soluble protective film for laser processing Highly purified water-soluble protective film for semiconductor processes - HogoMax is a water-soluble resin that prevents particles from ...
IF_SERIES
Product Classification

IF SERIES

High performance grinding wheel that provides a stable surface finish
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc The IF Series in-feed grinding ...
IF_SERIES
Product Classification

Poligrind

Achieves high-quality processing through backgrinding
Applications: Silicon wafer, etc Poligrind is designed to be used on the second spindle of precision in-feed grinders. Without any change in ...
stayclean-F
Product Classification

StayClean-F

Prevents pad corrosion during dicing Pad corrosion prevention For workpieces that have a long cut time, such as a workpiece with a small die size and a large ...
ultra
Product Classification

UltraPoligrind

Achieves both high die strength and gettering performance using ultra-fine diamonds
Applications: Silicon wafer, etc UltraPoligrind employs an ultra-fine diamond abrasive to create higher die ...
200 mm Wheel Guard
300 mm Wheel Guard
Product Classification

Wheel Guard

Protects wheel segments for streamlined wheel replacement and easier handling.



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