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DAG810
Automatic grinder to respond to new processing needs
Φ200 mm
1 axis, 1 chuck table
Simple and compact single-axis grinder
The DAG810 is a compact, automatic grinder for workpieces ...
DFG8340
Supports small volume grinding with high precisio
Φ200 mm
1 axis, 2 chuck tables
Stable, high-precision wafer processing
With the integration of devices, wafer manufacturing ...
DFG8540
Supports advancements for thinner wafers
Φ200 mm
2 axes, 3 chuck tables
Wafer Thinning
Thin grinding (<100 µm)
Advanced handling systems and design features facilitate high yield ...
DFG8560
Supports advancements for thinner and larger wafers
Φ300 mm
2 axes, 3 chuck tables
DBG
Wafer Thinning
Inherited grinding specifications with an established reputation
DFG8560 is ...
DFG8830
Grinder for thinning difficult-to-process materials
Φ150 mm
4 axes, 5 chuck tables
Support for the grinding of hard and brittle materials
This equipment is suitable for grinding ...
DFM2800
Realizes faster processing of ultrathin wafers
Φ300 mm
DBG
SDBG
Wafer Thinning
Realizes high yield thin wafer processing
The DFM2800 is a specialized wafer mounter for inclusion ...
DGP8761
High-efficiency grinder/polisher for Φ300 mm wafers
Φ300 mm
3 axes, 4 chuck tables
DBG
SDBG
Wafer Thinning
Stress Releaf
Realizes improvements in process stability and higher ...
Disco-DFG8640
Pursuing high-precision grinding of various workpieces
Φ200 mm
2 axes, 3 chuck tables
DBG
High-precision grinding
High-precision grinding has been required for power devices and ...
EX-300
EX Series
Model:
EX-300 for Gr-12
The EX series is an adopted motor drive for expansion stage operation.
Expansion stroke and expansion speed can be controlled numerically.
And film auto-cut function is equipped ...
FM-2246 / 2248 /2243
You can select a manual wafer mounter from a wide range of models to meet a variety of needs, from research and development to semi-custom production.
This manual wafer mounter series supports three different sizes of ...
FM-3343
This wafer mounter is ideal for diversified tape application and lamination conditions.
This model meets user requirements for manual equipment that is automated for only critical application work and that allows for ...
FM-6648 / 6643
This model was developed for both pre-cut and normal tape.
The industry's first universal wafer mounter, it not only serves as a dedicated wafer mounter for pre-cut or normal tape, but can also be adapted to the ...
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