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DAG810
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DAG810

Automatic grinder to respond to new processing needs Φ200 mm 1 axis, 1 chuck table Simple and compact single-axis grinder The DAG810 is a compact, automatic grinder for workpieces ...
DFG8340
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DFG8340

Supports small volume grinding with high precisio Φ200 mm 1 axis, 2 chuck tables Stable, high-precision wafer processing With the integration of devices, wafer manufacturing ...
DFG8540
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DFG8540

Supports advancements for thinner wafers Φ200 mm 2 axes, 3 chuck tables Wafer Thinning Thin grinding (<100 µm) Advanced handling systems and design features facilitate high yield ...
DFG8560
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DFG8560

Supports advancements for thinner and larger wafers Φ300 mm 2 axes, 3 chuck tables DBG Wafer Thinning Inherited grinding specifications with an established reputation DFG8560 is ...
DFG8830
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DFG8830

Grinder for thinning difficult-to-process materials Φ150 mm 4 axes, 5 chuck tables Support for the grinding of hard and brittle materials This equipment is suitable for grinding ...
8761
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DGP8761

High-efficiency grinder/polisher for Φ300 mm wafers Φ300 mm 3 axes, 4 chuck tables DBG SDBG Wafer Thinning Stress Releaf Realizes improvements in process stability and higher ...
stayclean-F
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StayClean-F

Prevents pad corrosion during dicing Pad corrosion prevention For workpieces that have a long cut time, such as a workpiece with a small die size and a large ...
staycleanR9
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StayClean-R

Conserving Water While Preventing Corrosion Prevents Corrosionby DI water The active component in StayClean-R continuously ...
Noncontact8
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Non contact setup

Blade tip position relative to the chuck table surface is detected by an optical sensor. Processing quality is stable since the blade wear can be measured at any time during processing.
Blade breakage sensor6
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Blade breakage sensor

Processing is stopped immediately if blade breakage occurs to minimize potential workpiece damage.

ultra_sonic
Ultrasonic-wave9
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Ultrasonic-wave dicing unit

Realizes high quality and high speed processing of difficult-to-cut materials Targets for ultrasonic-wave processing Ultrasonic-wave processing aims to achieve good processing ...
DWR1722
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DWR1722

Ultracompact DI water recycling unit with extraordinary energy and water conservation Numerous functions, ultra compact The DWR1722 is a DI water recycling unit for dicing saws ...
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