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DAG810
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DAG810

Automatic grinder to respond to new processing needs Φ200 mm 1 axis, 1 chuck table Simple and compact single-axis grinder The DAG810 is a compact, automatic grinder for workpieces ...
DFG8340
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DFG8340

Supports small volume grinding with high precisio Φ200 mm 1 axis, 2 chuck tables Stable, high-precision wafer processing With the integration of devices, wafer manufacturing ...
DFG8540
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DFG8540

Supports advancements for thinner wafers Φ200 mm 2 axes, 3 chuck tables Wafer Thinning Thin grinding (<100 µm) Advanced handling systems and design features facilitate high yield ...
DFG8560
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DFG8560

Supports advancements for thinner and larger wafers Φ300 mm 2 axes, 3 chuck tables DBG Wafer Thinning Inherited grinding specifications with an established reputation DFG8560 is ...
DFG8830
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DFG8830

Grinder for thinning difficult-to-process materials Φ150 mm 4 axes, 5 chuck tables Support for the grinding of hard and brittle materials This equipment is suitable for grinding ...
DFM8200
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DFM2800

Realizes faster processing of ultrathin wafers Φ300 mm DBG SDBG Wafer Thinning Realizes high yield thin wafer processing The DFM2800 is a specialized wafer mounter for inclusion ...
8761
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DGP8761

High-efficiency grinder/polisher for Φ300 mm wafers Φ300 mm 3 axes, 4 chuck tables DBG SDBG Wafer Thinning Stress Releaf Realizes improvements in process stability and higher ...
8640
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Disco-DFG8640

Pursuing high-precision grinding of various workpieces Φ200 mm 2 axes, 3 chuck tables DBG High-precision grinding High-precision grinding has been required for power devices and ...
EX-300
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EX-300

EX Series Model: EX-300 for Gr-12 The EX series is an adopted motor drive for expansion stage operation. Expansion stroke and expansion speed can be controlled numerically. And film auto-cut function is equipped ...
TEX-218G
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TEX-218G

TEX-218G for up to GR-8 The TEX series is adopted air cylinder for expansion stage operation. It makes equipment component become simple and realized easy maintenance.

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