Unique filter design for low filtration running costsDesigned for use next to a dicing saw Ultra-small footprint filtration system
This unit recycles dicing/grinding water and ...
High quality processing through direct link to dicing sawWorkpiece charging significantly reduced
The CO2 Injector lowers the resistivity of purified water by dissolving carbon ...
Manual cleaning system for Φ8-inch wafers with enhanced cleaning performance
The DCS1440 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the ...
Spin cleaning and drying for workpieces processed using dicing sawsManual cleaning system with enhanced cleaning performance
The DCS1441 is the optimal solution for cleaning and ...
Manual cleaning system for Φ300 mm wafers with enhanced cleaning performance
The DCS1460 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the ...
Grinder for thinning difficult-to-process materials
Φ150 mm
4 axes, 5 chuck tables
Support for the grinding of hard and brittle materials
This equipment is suitable for grinding ...
Realizes faster processing of ultrathin wafers
Φ300 mm
DBG
SDBG
Wafer Thinning
Realizes high yield thin wafer processing
The DFM2800 is a specialized wafer mounter for inclusion ...
High-efficiency grinder/polisher for Φ300 mm wafers
Φ300 mm
3 axes, 4 chuck tables
DBG
SDBG
Wafer Thinning
Stress Releaf
Realizes improvements in process stability and higher ...
Next generation water temperature control unit which has improved cooling efficiency and water supply capacityStable High Precision Processing
DTU1550 is a water supply unit for ...
Higher Dicing quality with lower environmental impactSupport for dicing quality
The DTU162 keeps both spindle cooling water and cutting water at a constant temperature and suitable ...