Grinder for thinning difficult-to-process materials
Φ150 mm
4 axes, 5 chuck tables
Support for the grinding of hard and brittle materials
This equipment is suitable for grinding ...
High-efficiency grinder/polisher for Φ300 mm wafers
Φ300 mm
3 axes, 4 chuck tables
DBG
SDBG
Wafer Thinning
Stress Releaf
Realizes improvements in process stability and higher ...
Realizes faster processing of ultrathin wafers
Φ300 mm
DBG
SDBG
Wafer Thinning
Realizes high yield thin wafer processing
The DFM2800 is a specialized wafer mounter for inclusion ...
Prevents pad corrosion during dicingPad corrosion prevention
For workpieces that have a long cut time, such as a workpiece with a small die size and a large ...
Blade tip position relative to the chuck table surface is detected by an optical sensor. Processing quality is stable since the blade wear can be measured at any time during processing.
Realizes high quality and high speed processing of difficult-to-cut materialsTargets for ultrasonic-wave processing
Ultrasonic-wave processing aims to achieve good processing ...
Ultracompact DI water recycling unit with extraordinary energy and water conservationNumerous functions, ultra compact
The DWR1722 is a DI water recycling unit for dicing saws ...
Dedicated unit for injecting StayClean into cutting water
Highly accurate dilution control to ratios as low as 1:10,000.
• Automatic bottle replacement enables continuous ...
Next generation water temperature control unit which has improved cooling efficiency and water supply capacityStable High Precision Processing
DTU1550 is a water supply unit for ...
Manual cleaning system for Φ8-inch wafers with enhanced cleaning performance
The DCS1440 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the ...