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Blade breakage sensor
Processing is stopped immediately if blade breakage occurs to minimize potential workpiece damage.
CC Filter Unit
Unique filter design for low filtration running costs
Designed for use next to a dicing saw Ultra-small footprint filtration system
This unit recycles dicing/grinding water and ...
CO 2 Injector
High quality processing through direct link to dicing saw
Workpiece charging significantly reduced
The CO2 Injector lowers the resistivity of purified water by dissolving carbon ...
DCS1440
Manual cleaning system for Φ8-inch wafers with enhanced cleaning performance
The DCS1440 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the ...
DCS1441
Spin cleaning and drying for workpieces processed using dicing saws
Manual cleaning system with enhanced cleaning performance
The DCS1441 is the optimal solution for cleaning and ...
DCS1460
Manual cleaning system for Φ300 mm wafers with enhanced cleaning performance
The DCS1460 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the ...
DFD6240
Among the world’s smallest fully automatic dicing saws
Φ200 mm Single spindle
Factory-friendly design
By optimizing the frame structure and handling section layout, the ...
DFD6341
Offering improved productivity of fully automatic dual spindle dicing saws by introducing measures to increase throughput with proven records in the field
Φ200 mm Facing dual ...
DFD6362
Dicing saw for improved productivity with Φ300 mm wafers
Φ300 mm Facing dual spindle
Realizes further productivity improvement with various new functions
DFD6362 offers a ...
DFD6450
Fully automatic dicing saw with parallel dual spindles
Φ200 mm
Parallel dual spindle
Package Singulation
A parallel dual design unique to DISCO
Featuring parallel dual-spindles, ...
DFD6560
A space-saving solution for Φ300 mm dicing
Φ300 mm
Facing dual spindle
16% reduced footprint
DFD6560 is equipped with uniquely developed short spindles and an optimized ...
DFD6760
High end dicing saw for Φ300 mm wafers
Φ300 mm
Facing dual spindle
Fully automatic dicing saw with dual chuck tables
DFD6760 is a high end model which has further enhanced ...
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