DFL7160
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Disco
Φ300 mm
Ablation
- DFL7160 is a fully-automatic laser saw for Φ300 mm wafers which uses a pulse laser to achieve non-thermal processing.
- This model has seen wide use in many applications such as GaAs full cut and DAF cut after DBG.
- Wafer contamination from laser processing particles can be prevented through installation of the HogoMax * coating/cleaning mechanism.
*A water-soluble protective film that prevents laser processing particles from adhering to the wafer surface
Adoption of a short pulse laser
Achieves high-quality processing with less processing distortion and deformation due to heating.
Compatibility with various applications
DFL7160 also supports applications for removing TEG on low-k grooves or streets and performing full cut for Si and compound semiconductors.
Kerf check function
Automatically checks and adjusts the laser cut position. This function is installed as a standard specification, making it possible to achieve stable processing.
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