DFG8560
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Disco
Φ300 mm
2 axes, 3 chuck tables
DBG
Wafer Thinning
Inherited grinding specifications with an established reputation
DFG8560 is the successor to the DFG800 series, equipment used by premier manufacturers worldwide. Equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.
Thin grinding (100 µm)
The DFG8560 can be integrated with DISCO's Dicing Before Grinding (DBG) system as well as polishers (DFP8160) for in-line processing solutions.
Design flexibility
Advanced handling systems and design features facilitate high yield for thin wafer grinding.
Improved grinding quality
More stable Z2-axis grindability is achieved by matching the Z1 and Z2-axis grinding points. This reduces total thickness variation on the wafer as well as wafer to wafer thickness variation, contributing to more stable thinning quality.
Compatibility with existing models
Grinding wheels, dresser boards, spindles, and chuck tables for the existing 800 series are also compatible with DFG8560.
Easy operation
Installation of a touch screen and GUI (Graphical User Interface) provides improved operability. In addition, processing and equipment status are displayed on-screen and each operation can be performed just by touching the icons. Thus, high operability during processing and maintenance is achieved.
Specifications:
*Please read the standard specification sheet thoroughly before use.
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