DAS8930
Back to: Surface Planers
Disco
Φ300 mm
1 axis, 1 chuck table
Planarization
Ultrahigh-precision planarization technology using a diamond bit
The DISCO surface planer provides solutions for high-precision planarization of ductile materials such as metals, resins, and their composites as well as solutions for reducing bump height variation and surface roughness.
Processability by workpiece material
Bump planarization
The planarization process reduces Au bump height variation and stress (temperature and load) when bonding Au-Au interfaces for use in next generation SiP solutions.
LED phosphor resin planarization
Variations in resin thickness of the LED emission unit is the cause of color irregularities. Planarization of the resin and bumps with high accuracy using a diamond bit can contribute towards the stabilization of LED color emissions.
Protective tape planarization
Backgrinding of wafers with large bumps can result in high wafer thickness variation. The final wafer surface thickness variation can be reduced by tape planarization prior to grinding.
*Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.
Related Products
Back to Surface Planers
DAS8920
Semi-automatic surface planer for Φ8-inch wafers Φ200 mm 1 axis, 1 chuck table Planarization Ultrahigh-precision planari…
DFS8910
Fully-automatic surface planer for Φ8-inch wafers Φ200 mm 1 axis, 1 chuck table Planarization Ultrahigh-precision planar…
DFS8960
Fully-automatic surface planer for Φ300 mm wafers Φ300 mm 2 axes, 2 chuck tables Planarization Ultrahigh-precision plana…