Disco-DAD324
Back to: Automatic
Disco
Φ150 mm
Single spindle
Support for a variety of applications from semiconductor wafers to electronic parts
DAD324 is a single-axis dicing saw which is compatible with workpieces up to Φ6 inches with a 2.0 kW high-torque spindle. 150 x 150 mm workpieces can be processed using a user-specified specification.
High productivity
Software operation speed and response speed are improved through the adoption of a high-performance MCU. The axis speed is accelerated and throughput is improved by adopting servo motors for all axes. In addition, this model uses PC electric components as standard and supports communication control as an option. The high-speed NCS (Non-Contact Setup) reduces measurement time.
World’s smallest footprint*
Compact design with a width of 490 mm
he reduced profile contributes towards a large increase in terms of productivity per unit area, especially when multiple.
* Investigated internally
Ease of operation
- XIS (Extended Interface System)
Operation buttons are consolidated on the microscope screen. - Wafer mapping
The processing status is displayed visually in the same way as fully automatic equipment. - Log viewer
Analog data is displayed in a graph and equipment data is more easily visualized. - Help viewer
Troubleshooting is displayed when an error occurs to achieve quick and accurate recovery support. - Automatic alignment
- Autofocus
- Automatic kerf check


*Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.
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