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ZH05 Series
Provides stable processing through high-accuracy concentration control
Electroformed bond
Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), Oxide wafers (LiTaO3, etc.), ...
ZH14 Series
Adoption of the newly developed and highly rigid V1 bond to realize stable processing under high load conditions
Electroformed bond
Applications: Silicon wafer, Compound ...
ZHCR Series
Provides stable processing through increased blade edge deformation resistance
Electroformed bond
Applications: Silicon wafer, etc
For relatively thick blades in excess of 60 ...
ZHFX Series
Achieves continuous, high-quality processing of oxide wafers
Electroformed bond
Applications: Oxide wafers (LiTaO3, etc.), etc
The ZHFX Series employs a bond that has ideal wear properties for ...
ZHZZ Series
Ultrathin hub blades for stable dicing of narrow street wafers
Electroformed bond
Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), etc
ZHZZ series hub blades were ...
ZHDG Series
Electroformed hub blades producing high quality substrate dicing
Electroformed bond Applications: Chip LED board, Various types of semiconductor packages, etc The ZHDG series developed for ...
Electroformed bond Applications: Chip LED board, Various types of semiconductor packages, etc The ZHDG series developed for ...
ZHRF Series
Prevents slant and wavy cutting due to increased blade rigidity
Electroformed bond
Applications: Silicon wafer, etc
By employing new technologies, the blade strength is improved compared to ZH05 ...
NBC-ZH Series
Achieves high productivity and superb dicing results through excellent dicing performance and long life
Electroformed bond
Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, ...
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