DFL7161
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High-quality, high-throughput standard laser grooving model
Φ300 mm
Ablation
*A water-soluble protective film that prevents laser processing particles from adhering to the wafer surface
Φ300 mm
Ablation
- DFL7161 is a fully automatic laser saw for Φ300 mm wafers which has already seen wide use.
- It performs a series of processes from HogoMax* coating and dicing to automatic cleaning.
- The HogoMax coating and cleaning sections are located separately to significantly reduce waiting time.
*A water-soluble protective film that prevents laser processing particles from adhering to the wafer surface
Compatibility with various applications
DFL7161 also supports applications for removing TEG on low-k grooves or streets and performing full cut for Si and compound semiconductors.
High-speed axes
Maximum speed is increased through improved transfer and processing axis performance, achieving higher productivity.
Kerf check function
Automatically checks and adjusts the laser cut position. This function is installed as a standard specification, making it possible to achieve stable processing.
*Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.