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ZH05SERIES
Product Classification

ZH05 Series

Provides stable processing through high-accuracy concentration control Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), Oxide wafers (LiTaO3, etc.), ...
ZH14SERIES
Product Classification

ZH14 Series

Adoption of the newly developed and highly rigid V1 bond to realize stable processing under high load conditions Electroformed bond Applications: Silicon wafer, Compound ...
zhcrseries
Product Classification

ZHCR Series

Provides stable processing through increased blade edge deformation resistance Electroformed bond Applications: Silicon wafer, etc For relatively thick blades in excess of 60 ...
ZHFX1_SERIES
Product Classification

ZHFX Series

Achieves continuous, high-quality processing of oxide wafers Electroformed bond Applications: Oxide wafers (LiTaO3, etc.), etc The ZHFX Series employs a bond that has ideal wear properties for ...
ZHFX1_SERIES
Product Classification

ZHZZ Series

Ultrathin hub blades for stable dicing of narrow street wafers Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), etc ZHZZ series hub blades were ...
zhdg1
zhdg2
Product Classification

ZHDG Series

Electroformed hub blades producing high quality substrate dicing
Electroformed bond Applications: Chip LED board, Various types of semiconductor packages, etc The ZHDG series developed for ...
ZHRF
Product Classification

ZHRF Series

Prevents slant and wavy cutting due to increased blade rigidity Electroformed bond Applications: Silicon wafer, etc By employing new technologies, the blade strength is improved compared to ZH05 ...
nbc-zh
Product Classification

NBC-ZH Series

Achieves high productivity and superb dicing results through excellent dicing performance and long life Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, ...

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