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b1_a
b1
Product Classification

B1A Series

Realizes precise processing of difficult to cut materials based on superior wear resistance and rigidity
Metal bond Applications: Electronics components, Optical devices, Various types of ...
DFM8200
Product Classification

DFM2800

Realizes faster processing of ultrathin wafers Φ300 mm DBG SDBG Wafer Thinning Realizes high yield thin wafer processing The DFM2800 is a specialized wafer mounter for inclusion ...
EX-300
Product Classification

EX-300

EX Series Model: EX-300 for Gr-12 The EX series is an adopted motor drive for expansion stage operation. Expansion stroke and expansion speed can be controlled numerically. And film auto-cut function is equipped ...
FM-22464
Product Classification

FM-2246 / 2248 /2243

You can select a manual wafer mounter from a wide range of models to meet a variety of needs, from research and development to semi-custom production. This manual wafer mounter series supports three different sizes of ...
3343
Product Classification

FM-3343

This wafer mounter is ideal for diversified tape application and lamination conditions. This model meets user requirements for manual equipment that is automated for only critical application work and that allows for ...
6648
Product Classification

FM-6648 / 6643

This model was developed for both pre-cut and normal tape. The industry's first universal wafer mounter, it not only serves as a dedicated wafer mounter for pre-cut or normal tape, but can also be adapted to the ...
FM-903S2
Product Classification

FM-903S

FM-903 is normal type semi-automatic wafer mounter up to 8 inch(200mm) size of work. Automatic operation means the operator is required only for loading and unloading workpieces. This contributes to stable tape and ...
grip ring3
Product Classification

Grip Ring

A reinforced plastic double grip rings are consist of inner and outer rings.
p1a_series
Product Classification

P1A Series

With an emphasis on cutting performance, this blade provides high processing quality for difficult-to-cut materials
Resin bond Applications: Glass, Crystal, Quartz, LiTaO3, Various types of ...
z05_2
Product Classification

R07 Series

Realizes high-grade cutting of various hard, brittle materials with a wide range of bonds
Resin bond Applications: Glass, Quartz, Ceramics, etc A bond material optimal for the characteristics ...
TEX-218G
Product Classification

TEX-218G

TEX-218G for up to GR-8 The TEX series is adopted air cylinder for expansion stage operation. It makes equipment component become simple and realized easy maintenance.

Product Classification

TM11 Series

Metallic blades that realize higher rigidity
Improved blade rigidity By employing a high-rigidity bond, the TM11 series ...
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