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Cassette and tape frame
High precision products to facilitate stable production from tape mounter
to die bonder. Meets the ø300 mm wafer SEMI standard.
HogoMax
HogoMax Series
Water-soluble protective film for laser processing
Highly purified water-soluble protective film for semiconductor processes
- HogoMax is a water-soluble resin that prevents particles from ...
ICROS™ Tape
“ICROS™ Tape has been the world's top protective tape used in semiconductor wafer backgrinding (BG) for many decades. In order to meet the strict requirements of the semiconductor market, we optimize the whole ...
StayClean-F
Prevents pad corrosion during dicing
Pad corrosion prevention
For workpieces that have a long cut time, such as a workpiece with a small die size and a large ...
UVB-608i for up to 8"
Black-light type UVB-608i
UVB-608i is adopted black-light fluorescent lamp and designed minimal specification for
exceptional cost-performance value.
UVC-300
Model: UVC-300A for up to 12”
UV-LED models which have a long life and low running cost are
cassette to cassette fully automatic system and 200mm (8”) manual
and 300mm (12”)
UVC-408 for 8”
High- pressure Mercury lamp models which have perfect UV curing
performances is 200mm (8”) manual and 300mm (12”) manual
system.
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