You can select a manual wafer mounter from a wide range of models to meet a variety of needs, from research and development to semi-custom production. This manual wafer mounter series supports three different sizes of ...

This wafer mounter is ideal for diversified tape application and lamination conditions. This model meets user requirements for manual equipment that is automated for only critical application work and that allows for ...

This model was developed for both pre-cut and normal tape. The industry's first universal wafer mounter, it not only serves as a dedicated wafer mounter for pre-cut or normal tape, but can also be adapted to the ...

“ICROS™ Tape has been the world's top protective tape used in semiconductor wafer backgrinding (BG) for many decades. In order to meet the strict requirements of the semiconductor market, we optimize the whole ...

Achieves high productivity and superb dicing results through excellent dicing performance and long life Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, ...

Provides stable processing through high-accuracy concentration control Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), Oxide wafers (LiTaO3, etc.), ...

Provides stable processing through increased blade edge deformation resistance Electroformed bond Applications: Silicon wafer, etc For relatively thick blades in excess of 60 ...

Electroformed hub blades producing high quality substrate dicing
Electroformed bond Applications: Chip LED board, Various types of semiconductor packages, etc The ZHDG series developed for ...

Achieves continuous, high-quality processing of oxide wafers Electroformed bond Applications: Oxide wafers (LiTaO3, etc.), etc The ZHFX Series employs a bond that has ideal wear properties for ...