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DFG8830
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DFG8830

Grinder for thinning difficult-to-process materials Φ150 mm 4 axes, 5 chuck tables Support for the grinding of hard and brittle materials This equipment is suitable for grinding ...
DFM8200
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DFM2800

Realizes faster processing of ultrathin wafers Φ300 mm DBG SDBG Wafer Thinning Realizes high yield thin wafer processing The DFM2800 is a specialized wafer mounter for inclusion ...
8761
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DGP8761

High-efficiency grinder/polisher for Φ300 mm wafers Φ300 mm 3 axes, 4 chuck tables DBG SDBG Wafer Thinning Stress Releaf Realizes improvements in process stability and higher ...
UVB-608i
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UVB-608i for up to 8"

Black-light type UVB-608i UVB-608i is adopted black-light fluorescent lamp and designed minimal specification for exceptional cost-performance value.
uvc300
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UVC-300

Model: UVC-300A for up to 12” UV-LED models which have a long life and low running cost are cassette to cassette fully automatic system and 200mm (8”) manual and 300mm (12”)
UVC-4088
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UVC-408 for 8”

High- pressure Mercury lamp models which have perfect UV curing performances is 200mm (8”) manual and 300mm (12”) manual system.

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