Grinder for thinning difficult-to-process materials
Φ150 mm
4 axes, 5 chuck tables
Support for the grinding of hard and brittle materials
This equipment is suitable for grinding ...
Realizes faster processing of ultrathin wafers
Φ300 mm
DBG
SDBG
Wafer Thinning
Realizes high yield thin wafer processing
The DFM2800 is a specialized wafer mounter for inclusion ...
High-efficiency grinder/polisher for Φ300 mm wafers
Φ300 mm
3 axes, 4 chuck tables
DBG
SDBG
Wafer Thinning
Stress Releaf
Realizes improvements in process stability and higher ...
You can select a manual wafer mounter from a wide range of models to meet a variety of needs, from research and development to semi-custom production.
This manual wafer mounter series supports three different sizes of ...
This wafer mounter is ideal for diversified tape application and lamination conditions.
This model meets user requirements for manual equipment that is automated for only critical application work and that allows for ...
This model was developed for both pre-cut and normal tape.
The industry's first universal wafer mounter, it not only serves as a dedicated wafer mounter for pre-cut or normal tape, but can also be adapted to the ...
FM-903 is normal type semi-automatic wafer mounter up to 8 inch(200mm) size of work.
Automatic operation means the operator is required only for loading and unloading workpieces. This contributes to stable tape and ...