Product Filter
Results 1 - 7 of 7
Cassette and tape frame
High precision products to facilitate stable production from tape mounter
to die bonder. Meets the ø300 mm wafer SEMI standard.
DFG8830
Grinder for thinning difficult-to-process materials
Φ150 mm
4 axes, 5 chuck tables
Support for the grinding of hard and brittle materials
This equipment is suitable for grinding ...
DFM2800
Realizes faster processing of ultrathin wafers
Φ300 mm
DBG
SDBG
Wafer Thinning
Realizes high yield thin wafer processing
The DFM2800 is a specialized wafer mounter for inclusion ...
DGP8761
High-efficiency grinder/polisher for Φ300 mm wafers
Φ300 mm
3 axes, 4 chuck tables
DBG
SDBG
Wafer Thinning
Stress Releaf
Realizes improvements in process stability and higher ...
HogoMax
HogoMax Series
Water-soluble protective film for laser processing
Highly purified water-soluble protective film for semiconductor processes
- HogoMax is a water-soluble resin that prevents particles from ...
StayClean-F
Prevents pad corrosion during dicing
Pad corrosion prevention
For workpieces that have a long cut time, such as a workpiece with a small die size and a large ...
Head Office
- Paseo 4B, Paseo de Sta. Rosa, Greenfield City, Sta. Rosa, Laguna Philippines 4026
- +63 908 887 4217
- +63 998 961 9440
- info@aurotech.com
Clark Office
Baguio Office
Cebu Office