Semi-automatic surface planer for Φ8-inch wafers
Φ200 mm
1 axis, 1 chuck table
Planarization
Ultrahigh-precision planarization technology using a diamond bit
The DISCO surface ...
Semi-automatic surface planer for Φ300 mm wafers
Φ300 mm
1 axis, 1 chuck table
Planarization
Ultrahigh-precision planarization technology using a diamond bit
The DISCO ...
Among the world’s smallest fully automatic dicing saws
Φ200 mm Single spindle
Factory-friendly design
By optimizing the frame structure and handling section layout, the ...
Offering improved productivity of fully automatic dual spindle dicing saws by introducing measures to increase throughput with proven records in the field
Φ200 mm Facing dual ...
Dicing saw for improved productivity with Φ300 mm wafers
Φ300 mm Facing dual spindle
Realizes further productivity improvement with various new functions
DFD6362 offers a ...
A space-saving solution for Φ300 mm dicing
Φ300 mm
Facing dual spindle
16% reduced footprint
DFD6560 is equipped with uniquely developed short spindles and an optimized ...
High end dicing saw for Φ300 mm wafers
Φ300 mm
Facing dual spindle
Fully automatic dicing saw with dual chuck tables
DFD6760 is a high end model which has further enhanced ...
Fully-automatic surface planer for Φ8-inch wafers
Φ200 mm
1 axis, 1 chuck table
Planarization
Ultrahigh-precision planarization technology using a diamond bit
The DISCO ...
Fully-automatic surface planer for Φ300 mm wafers
Φ300 mm
2 axes, 2 chuck tables
Planarization
Ultrahigh-precision planarization technology using a diamond bit
The DISCO ...
Standard dual spindle dicing saw
Φ200 mm Facing dual spindle DBG Package Singulation
Maximized throughput
The DFD6340 features a facing dual-spindle configuration ...
Advanced performance for Φ300 mm dicing
Φ300 mm Facing dual spindle DBG
Enhanced dicing throughput
The DFD6361 enhances throughput in two distinct ways. DISCO’s facing dual ...