fbpx
Image

Product Filter

Results 1 - 12 of 25
DAD322026
Product Classification

DAD3220

Dicing Saw for 6 × 6-inch Workpieces Designed for Compactness Φ150 mm Single spindle Compatible with 6 × 6-inch Workpieces Using a User-Specified Specification Single-axis dicing ...
DAD3236
Product Classification

DAD323

World’s Smallest* Dicing Saw which Supports Diversified Processing from Semiconductor Wafers to Electric Components Φ150 mm Single spindle Diversified Processes The DAD323 is a ...
DAD3230
Product Classification

DAD3230

Compact Dicing Saw for Φ6-inch Workpieces with Superior Expandability Φ150 mm Single spindle Compatible with 6 x 6-inch Workpieces Using a User-Specified Specification Single-axis ...
DISCO-DAD32409
Product Classification

DAD3240

Simple and Compact Manual Dicing Saw Compatible with Φ8-inch Workpieces Φ200 mm Single spindle High processability Adoption of a 1.8 kW high-output spindle enables the processing ...
DISCO-DAD3350
Product Classification

DAD3350

Flexibility for diverse processing needs Φ200 mm Single spindle Supports a wide range of applications DAD3350 is capable of handling a maximum of Φ8-inch or 250 x 250 mm ...
DISCO-DAD3360
Product Classification

DAD3360

Φ300 mm manual dicer to meet a variety of needs Φ300 mm Single spindle Exceptional processing flexibility While offering an even more compact footprint than the existing ...
DAD3430
Product Classification

DAD3430

Φ6-inch Compact Dicing Saw Which Achieves High-Precision, High-Quality Processing Φ150 mm Single spindle Compatible with 6 x 6-inch Workpieces Using a User-Specified ...
DISCO-DAD3650
Product Classification

DAD3650

Ultra compact dual-spindle automatic dicing saw Φ200 mm Facing dual spindle Small footprint The optimal design of the DAD3650 combines high functionality and ultra compactness ...
DISCO-DAD3660
Product Classification

DAD3660

Dual spindle automatic dicing saw for large packaging substrates Φ300 mm Facing dual spindle Package Singulation Support for workpiece sizes up to 360 × 360 mm By selecting a ...
DFM8200
Product Classification

DFM2800

Realizes faster processing of ultrathin wafers Φ300 mm DBG SDBG Wafer Thinning Realizes high yield thin wafer processing The DFM2800 is a specialized wafer mounter for inclusion ...
3221
Product Classification

Disco-DAD3221

Evolved Compact Dicing Saw Φ150 mm Single spindle Compatible with Diverse Small Workpiece Processing Needs DAD3221 is a single-axis dicing saw which achieves processing of ...
DAD3230
Product Classification

Disco-DAD3231

Evolved Compact Dicing Saw Φ150 mm Single spindle Focus on Functionality and Expandability DAD3231, designed for high performance and expandability, just like the conventional ...
Page 1 of 3

Head Office

Clark Office

Baguio Office

Cebu Office